Patents

A process for diffusion soldering

The present invention provides to a process for diffusion soldering which comprises selecting metallic/alloy constituents consisting of a first metallic element, liquid at room temperature; a second metallic element in powder form capable of forming intermettalic compound with atleast one of the metals to be joined and a third metallic element in powder form capable of forming intermettalic compound with the metal with which the second metallic element powder does not form an intermediate compound, mixing the said constituent to form a metallic paste composition, cleaning the areas of the metals to be joined by conventional methods, providing on the said areas a thin layer of the above said metallic paste composition and contacting the said metallic paste coated areas to form an intermetallic sandwich, subjecting the said intermetallic sandwich to a temperature of 600-800°C and pressure of 0.1-1 MPa for a period of 5-15 minutes under vacuum to attain intermetallic phases for forming a joint.

Patent Assignee:

Patent No: IN233097 [India]

Application No: 354/DEL/2002

Inventor(s): Satish Kumar Bhatnagar; H C Wolfgang Gust; Pramod Kumar Khanna; Eric J Mittemeijer; Eng Silvana Sommadossi

Issue Date: 27-03-2009

Filing Date: 27-03-2002

Licensing Option: Laboratory willing to jointly develop technology with industrial partner.

Implementing institute: CSIR-Central Electronics Engineering Research Institute[CSIR-CEERI] 

Funding agency: Council of Scientific and Industrial Research (CSIR)

IPC Classification: B23K31/02

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