Executive Summary : | The demand for parts with micro-features, such as micro-channels, micro-holes, and 3-D structures, is rapidly increasing in various fields like biomedical, electronics, and optics. These parts are often made of brittle materials like silicon, quartz, and glass. LIGA (Lithographie, Galvanoformung, Abformung) is a route for bulk production of micro-features, but the cost of synchrotron and associated devices is high. Laser micro-machining is also popular, but it suffers from limitations like heat-affected zones, thermal residual stresses, and undesirable changes in work material microstructures. Tapering of micro-holes or micro-channels is another issue. Secondary processing is necessary for precision products, and micro-EDM has limitations like tool wear and formation of recast layers. Micro-grinding is a mechanical micro-machining technique that can produce high-aspect ratio micro-features in brittle materials without the need for secondary processing. However, the challenge lies in fabricating the high precision tool substrate and depositing a strong, well-adherent abrasive layer containing diamond/cBN abrasive grits on the tool periphery. This proposal aims to develop a low-cost indigenous route to fabricate micro-grinding tools through a novel process chain. The work will involve fabrication of precision WC-Co micro-substrates through micro-ECM, deposition of abrasive layer on the micro-substrate through electroless route, and assessment of micro-grinding performance while cutting micro-slots on brittle materials like silicon and quartz. |