Technologies

Chemical Sciences

Title:

Lead Free Electroplating Process for Cu-Sn Alloy and Ag-Bi Bilayer

Area:

Chemical Sciences

Focus Area:

Industrial appliances

Developing Agency:

CSIR-Central Electro Chemical Research Institute(CECRI), Karaikudi

Technology Readiness Index:

Technology Demonstration

Brief Description

Description :

The plated Cu-Sn alloy and Ag-Bi bilayer gives good mechanical properties than Cu-Pb-Sn alloy for bearing applications. With this technology we can eliminate hazardous Pb in the alloy compositions. The technology provide good mechanical properties and plating rate.

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