Technologies
Title: | Lead-Free Electroplating Process for Cu-Sn Alloy and Ag-Bi Bilayer |
Area: | Physical Sciences |
Focus Area: | Electroplating |
Social Benefits: | Good mechanical properties , Eliminating hazardous Pb in the alloy composition (Lead free process) , Good cathodic current efficiency , Good plating rate , Simplest process. |
Developing Agency: | CSIR-Central Electro Chemical Research Institute (CECRI), Tamil Nadu |
Technology Readiness Index: | Technology Demonstration |
Email: | director@cecri.res.in |
| Website Link : | http://www.cecri.res.in |
| Source (more info) : | https://t.ly/l_sb |
Brief Description
Description : | Used for bearings. |