Research

Material Sciences

Title :

Development of hermetic encapsulation technique for wafer-level packaging of MEMS sensors

Area of research :

Material Sciences, Physical Sciences

Focus area :

Wafer-level packaging of MEMS sensors

Principal Investigator :

Dr Pradeep Dixit, Assistant Professor, Indian Institute of Technology (IIT) Bombay

Timeline Start Year :

2019

Timeline End Year :

2021

Contact info :

Details

Total Budget (INR):

43,63,200

Organizations involved