Research

Engineering Sciences

Title :

Development of hermetic encapsulation technique for wafer-level packaging of MEMS sensors

Area of research :

Engineering Sciences

Focus area :

Advanced Manufacturing Technologies, AMT

Principal Investigator :

Dr. P. Dixit, Assistant Professor, Indian Institute of Technology (Bombay), Maharshtra, Maharashtra

Timeline Start Year :

2019

Timeline End Year :

2021

Contact info :

Details

Total Budget (INR):

43,63,200

Organizations involved